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熱激活膠帶

提供各種膠帶，由PET、無紡布、泡沫、涂有丙烯酸、硅樹脂、橡膠、熱熔、熱轉化粘合劑的PI基材制成。可提供各種寬度、長度和釋放襯墊，以滿足特定需求，專為工業(yè)、商業(yè)和家庭應用的特殊環(huán)境而設計。

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Product P/N	Total Thickness (um)	Type	Carrier	Bonding Strength MPa SUS/SUS	Soft Point (℃）	Color	Adhesive Type	Pre-Lamination	Recommended Bonding Conditions	Feature/Application
HT Series
HT6501	10	Double-sided	E	>2	50-70	Transparent	Thermal Setting	Glue Line Temperature. 50-70°C Dwell Time: 5-15 Seconds Pressure: 2-4 Bar	Glue Line Temperature: min.120°C Dwell Time: 30-120 Seconds Pressure: 2.8-5 Bar	1.Weak adhesion at room temperature, good adhesion to metal, glass and PI after curing 2.Good impact performance and heat/moisture resistance 3.No further post-curing is required after thermal activation during bonding
HT2013P	130	Single-sided	PI/PET	>7		Amber/Black	Thermal Setting	2 kg rubber hand roller 5 mm/s, 3 times in each direction	150℃10min+180℃20min	Electrical insulation;Cooling Plate
HT5601	10	Double-sided	none	>3	90-120	Transparent	Thermal Setting	Glue Line Temperature. 35-130°C Dwell Time: 5-30 Seconds Pressure: 3-11 Bar	Glue Line Temperature: 170-200°C Dwell Time: 10-30 min Pressure: 3-11 Bar	1.High temperature resistance after curing 2.Outstanding resistance against chemicals 3.Good adhesion on metals, glass, ceramic materials, textiles, and polymer film after curing. 4.Easy handling performance for die cutting
HT5602	20	Double-sided	none	>4	90-120	Transparent	Thermal Setting	Glue Line Temperature. 35-130°C Dwell Time: 5-30 Seconds Pressure: 3-11 Bar	Glue Line Temperature: 170-200°C Dwell Time: 10-30 min Pressure: 3-11 Bar	1.High temperature resistance after curing 2.Outstanding resistance against chemicals 3.Good adhesion on metals, glass, ceramic materials, textiles, and polymer film after curing. 4.Easy handling performance for die cutting
HT5610	100	Double-sided	none	＞20	90-120	Transparent	Thermal Setting	Glue Line Temperature. 50-70°C Dwell Time: 5-15 Seconds Pressure: 2-4 Bar	Glue Line Temperature: 180-200°C Dwell Time: 10-30 min Pressure: 2-5 Bar	1.High temperature resistance after curing 2.Outstanding resistance against chemicals 3.Good adhesion on metals, glass, ceramic materials, textiles, and polymer film after curing. 4.Easy handling performance for die cutting
LT Series
LT0100B	100	Double-sided	none	>5	45-60	Black	Thermal Setting	Glue Line Temperature. 50-60°C Dwell Time: 5-15 Seconds Pressure: 2-4 Bar	Glue Line Temperature: min.75°C Dwell Time: 30-120 Seconds Pressure: 2.8-5 Bar	1. Extremely strong bonding for leather, PC. metal, etc. 2. Activated at low temperature and pressure 3. Thermal setting type, can't be re-activated
LU Series
LU2305	50	Double-sided	none	>10	/	Transparent	UV Setting	2 kg rubber hand roller 5 mm/s, 3 times in each direction	70mW 365nm LED@60sec 70℃@3hrs	1.Tackiness at room temperature for handling 2.UV curing of opaque substrates 3.Can be heat accelerated to reduce curing time 4.Have good strength and reliability on metals, plastics, textiles, and glass
LU2311L	110	Single-sided	PET	>5	/	Blue	UV Setting	2 kg rubber hand roller 5 mm/s, 3 times in each direction	70mW 365nm LED@60sec 70℃@3hrs	Electrical insulation
TP Series
TP3002	20	Double-sided	none	>2	90-120	Transparent	Thermal Setting	Glue Line Temperature. 50-70°C Dwell Time: 5-15 Seconds Pressure: 2-4 Bar	Glue Line Temperature: min.140°C Dwell Time: 30-120 Seconds Pressure: 2.8-5 Bar	1.Weak adhesion at room temperature, good adhesion to metal, glass and PI after curing 2.Good impact performance and heat/moisture resistance 3.No further post-curing is required after thermal activation during bonding 4.Zero emissions, zero VOC
TL Series
TL5010	100	Double-sided	none	>2	50-80	Transparent	Thermal Setting	Glue Line Temperature. 25-70°C Dwell Time: 5-15 Seconds Pressure: 1-5 Bar	Glue Line Temperature: 70-100°C Dwell Time: 5-60 s Pressure: 1-5 Bar	1.Tack at room temperature applicable as a pressure sensitive tape 2.Outstanding resistance against heat and chemicals 3.Good adhesion on SUS, AL, PI, PC, Glass and black coating Glass after activation. 4.Easy handling performance for die cutting
TL5025B	250	Double-sided	none	>2	50-80	Black	Thermal Setting	Glue Line Temperature. 25-70°C Dwell Time: 5-15 Seconds Pressure: 1-5 Bar	Glue Line Temperature: 70-100°C Dwell Time: 5-60 s Pressure: 1-5 Bar	1.Tack at room temperature applicable as a pressure sensitive tape 2.Outstanding resistance against heat and chemicals 3.Good adhesion on SUS, AL, PI, PC, Glass and black coating Glass after activation. 4.Easy handling performance for die cutting
EM Series	50-100	Double-sided	Cu/none	>7	90-120	Brownish red	Thermal Setting	Glue Line Temperature. 50-70°C Dwell Time: 5-15 Seconds Pressure: 2-4 Bar	Glue Line Temperature: 180-200°C Dwell Time: 10-30 min Pressure: 2-5 Bar	1.High temperature resistance after curing 2.Outstanding resistance against chemicals 3.Good adhesion on metals, glass, ceramic materials, textiles, and polymer film after curing. 4.Easy handling performance for die cutting 5.Good conductivity
TM Series	50-100	Double-sided	none	>7	90-120	White	Thermal Setting	Glue Line Temperature. 50-70°C Dwell Time: 5-15 Seconds Pressure: 2-4 Bar	Glue Line Temperature: 180-200°C Dwell Time: 10-30 min Pressure: 2-5 Bar	1.High temperature resistance after curing 2.Outstanding resistance against chemicals 3.Good adhesion on metals, glass, ceramic materials, textiles, and polymer film after curing. 4.Easy handling performance for die cutting 5.Good thermal conductivity

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